馮雪

教授、博導

清華大學教授、博導,973項目首席科學家、國家杰出青年基金獲得者,目前擔任應用力學教育部重點實驗室主任,清華大學航天航空學院院長助理

教育背景

  • 1994.9 - 1998.7   重慶大學   工程力學系、自動化系   雙學士學位
  • 1998.9 - 2003.1   清華大學   工程力學系        固體力學博士、碩士學位

工作履歷

  • 2004.09 - 2007.07   美國伊利諾伊大學(UIUC)機械工程系,博士后
  • 2005.07 - 2006.08   美國加州理工學院(Caltech)航空系,訪問博士后
  • 2007.07 - 2011.12   清華大學航天航空學院,副研究員
  • 2010.01 - 2010.07   美國伊利諾伊大學(UIUC)材料科學與工程系,訪問學者
  • 2011.12 -       清華大學航天航空學院,教授、博導

學術兼職

  1. 美國機械工程師學會(ASME)會刊Journal of Applied Mechanics 副主編;
  2. 英國物理學會(IOP)Flexible and Printed Electronics 編輯;
  3. Nature集團 npj Flexible Electronics 編輯;
  4. 《中國科學-技術科學》特邀青年編輯(青年工作委員會委員);
  5. 中國力學學會青年工作委員會副主任;
  6. 中國力學學會實驗力學專業委員會秘書長;
  7. 中國力學學會空天與武器裝備測試專業組組長;
  8. 中國力學學會學科交叉與復雜環境實驗方法專業組組長;

研究領域

柔性電子技術、可延展集成器件與大規模制造、極端復雜環境下實驗力學、航天熱防護技術等

研究概況

主要致力于將國家重大需求與基礎研究結合,面向航天航空熱防護與新興的可穿戴柔性集成器件兩大領域中的關鍵問題,分別發展了針對高溫/超高溫、可延展/超柔性等超常規環境的新型實驗方法、微器件與集成技術,所發展的高溫光學及其光電成像系統用于研究高溫超常規環境下固體材料/結構的失效機理,所發展的柔性電子技術用于健康醫療及復雜環境下運動監測。先后主持了國家重點基礎研究發展計劃(973 計劃)項目、國家科技重大專項、863項目、基金委近空間飛行器重大研究計劃培育項目、基金委國際合作重大項目、教育部優秀博士論文基金項目等。

獎勵與榮譽

  1. 2016年獲國家杰出青年科學基金
  2. 2016年獲教育部青年科學獎
  3. 2016年獲教育部技術發明獎一等獎(排名第一)
  4. 2016年獲中國機械工業科學技術獎一等獎(排名第一)
  5. 2016年入選全國優秀科技工作者
  6. 2012年獲基金委優秀青年基金
  7. 2011年獲第十二屆中國力學學會青年科技獎
  8. 2006年獲全國百篇優秀博士論文獎

發表論文、論著及專利

學術成果:
至今已正式發表SCI論文120多篇,英文書章1篇;
已授權國家發明專利22項,自主軟件著作權4項。

代表性期刊論文:

  1. Zhang, C., et al., Digital Gradient Sensing Method to Evaluate Thermal Stressat Elevated Temperatures. Experimental Mechanics, 2016. 56(6): p. 1123-1132.
  2. Wang, Y.X., et al., Buckling-Based Method for Measuring the Strain-PhotonicCoupling Effect of GaAs Nanoribbons. Acs Nano, 2016. 10(9): p. 8199-8206.
  3. Su, H., et al., Thermal shock resistance of alumina ceramics enhanced bynanostructured conformal coatings using metal-organic frameworks. ScriptaMaterialia, 2016. 119: p. 38-42.
  4. Su, H., et al., Synchronous Full-Field Measurement of Temperature andDeformation of C/SiC Composite Subjected to Flame Heating at High Temperature.Experimental Mechanics, 2016. 56(4): p. 659-671.
  5. Fang, X.F., et al., Formation mechanisms of characteristic structures on thesurface of C/SiC composites subjected to thermal ablation. Journal of theEuropean Ceramic Society, 2016. 36(3): p. 451-456.
  6. Chen, Y., et al., Biocompatible and Ultra-Flexible Inorganic Strain SensorsAttached to Skin for Long-Term Vital Signs Monitoring. IEEE Electron DeviceLetters, 2016. 37(4): p. 496-499.
  7. Qu, Z., et al., Measurements for displacement and deformation at hightemperature by using edge detection of digital image. Applied Optics, 2015.54(29): p. 8731-8737.
  8. Lu, B.W., et al., Ultra-flexible Piezoelectric Devices Integrated with Heart toHarvest the Biomechanical Energy. Scientific Reports, 2015. 5: p. 9.
  9. Li, Y., et al., In situ measurement of oxidation evolution at elevatedtemperature by nanoindentation. Scripta Materialia, 2015. 103: p. 61-64.
  10. Jia, J.M., et al., Experimental and numerical investigation on SiC coatingdelamination from C/SiC composites. Composites Science and Technology, 2015.110: p. 210-216.
  11. Fang, X.F., et al., Bio-Inspired Microstructure Design to Improve ThermalAblation and Oxidation Resistance: Experiment on SiC. Journal of the AmericanCeramic Society, 2015. 98(12): p. 4010-4015.
  12. Chen, Y., et al., Breathable and Stretchable Temperature Sensors Inspired by Skin.Scientific Reports, 2015. 5: p. 11.
  13. Huang, Y., et al., Controllable wrinkle configurations by soft micro-patternsto enhance the stretchability of Si ribbons. Soft Matter, 2014. 10(15): p.2559-2566.
  14. Feng, X., et al., Review on stretchable and flexible inorganic electronics.Acta Physica Sinica, 2014. 63(1): p. 18.
  15. Fang, X.F., et al., In situ observation and measurement of composites subjectedto extremely high temperature. Review of Scientific Instruments, 2014. 85(3):p. 35104-35104.
  16. Chen, H., et al., Interfacial Failure in Flexible Electronic Devices. IeeeElectron Device Letters, 2014. 35(1): p. 132-134.
  17. Chen, H., X. Feng, and Y. Chen, Slip zone model for interfacial failures ofstiff film/soft substrate composite system in flexible electronics. Mechanicsof Materials, 2014. 79: p. 35-44.
  18. Zhang, C.X., et al., Multiwavelength shearing interferometry for measuring theslopes, curvatures, and shapes of thin films/substrate systems. Optics Letters,2013. 38(24): p. 5446-5449.
  19. Dong, X.L., et al., Diffusion and Stress Coupling Effect during Oxidation atHigh Temperature. Journal of the American Ceramic Society, 2013. 96(1): p.44-46.
  20. Dong, X., et al., Full-field Measurement of Topography and Curvature byCoherent Gradient Sensing Method at High Temperature. Experimental Mechanics,2013. 53(6): p. 959-963.
  21. Chen, H., et al., Experiments and viscoelastic analysis of peel test withpatterned strips for applications to transfer printing. Journal of theMechanics and Physics of Solids, 2013. 61(8): p. 1737-1752.
  22. Chen, H., X. Feng, and Y. Chen, Directionally controlled transfer printingusing micropatterned stamps. Applied Physics Letters, 2013. 103(15): p. 4.
  23. Jiang, D.J., et al., Rate-dependent interaction between thin films andinterfaces during micro/nanoscale transfer printing. Soft Matter, 2012. 8(2):p. 418-423.
  24. Feng, X., et al., Stretchable Ferroelectric Nanoribbons with WavyConfigurations on Elastomeric Substrates. Acs Nano, 2011. 5(4): p. 3326-3332.
  25. Feng, X., et al., Wrinkles formation and evolution of nanoribbons with finitelength on elastomeric substrate. Applied Physics Letters, 2011. 99(14): p. 3.
  26. Dong, X.L., et al., Full-field measurement of nonuniform stresses of thin filmsat high temperature. Optics Express, 2011. 19(14): p. 13201-13208.
  27. Park, S.I., et al., Theoretical and Experimental Studies of Bending ofInorganic Electronic Materials on Plastic Substrates. Advanced FunctionalMaterials, 2008. 18(18): p. 2673-2684.
  28. Feng, X., Y. Huang, and A.J. Rosakis, Stresses in a multilayer thinfilm/substrate system subjected to nonuniform temperature. Journal of AppliedMechanics-Transactions of the Asme, 2008. 75(2): p. 7.
  29. Feng, X., Y. Huang, and A.J. Rosakis, Multi-layer thin films/substrate systemsubjected to non-uniform misfit strains. International Journal of Solids andStructures, 2008. 45(13): p. 3688-3698.
  30. Feng, X., et al., Competing fracture in kinetically controlled transferprinting. Langmuir, 2007. 23(25): p. 12555-12560.
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